Chemical Mechanical Planarization

We were one of the earliest providers of abrasives for chemical mechanical planarization (CMP) and we continue to deliver products that demonstrate a high level of performance and consistency.

Our fumed silica manufacturing technology, together with our statistical process control methods, have enabled us to further refine our products while offering consistent and reliable performance to the CMP industry. Additionally, our global manufacturing platform allows for manufacturing and technical support in Asia and North America.

Since the mid-1990s, the use of CMP has grown rapidly in the semiconductor manufacturing industry.

As a planarization technique, CMP facilitates smooth, clean and planar surfaces by using carefully formulated fumed metal oxide dispersions in conjunction with specially designed equipment and pads.

The highly-controlled CMP process requires high purity fumed silica for the various dispersions and slurries. Our fumed silica products enable CMP formulators to:

Optimize the polishing and removal rate
Deliver planarity and uniformity across the wafer during various integrated circuit (IC) fab steps
Minimize contaminant metals
Deliver uniform and consistent lot-to-lot performance

Applications

CMP is primarily used in the fabrication of integrated circuits, where it enables the formation of multilayered structures with controlled thickness and planarity.

Challenges

CMP is a complex process that poses several challenges.

Process Optimization

CMP is continuously evolving and significant research is devoted to process optimization.

Chemical Mechanical Planarization

Applications

Challenges​

Process Optimization​

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SDS

Challenges

Process Optimization